Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

It's critical that the surface of silicon wafers be as flat as possible so that as each metal layer is patterned, you minimize the risk of moving in and out of the focal plane of the imaging system.

With small geometry silicon processes, additional nonfunctional geometric structures are required to maintain layer planarity during the chemical/mechanical polishing (CMP) phase of processing. The ...

With the advent of copper interconnect and its susceptibility to topographical thickness variation, and with feature sizes on chips shrinking at each new process node, the impact of chemical ...