For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

The problem of variations induced by the chemical-mechanical polishing (CMP) step has been discussed for years in process engineering circles. Briefly, after each layer on the wafer is completed, the ...

Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...