TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

South Koreas SK Hynix is accelerating its push into the artificial intelligence semiconductor market with a major new ...

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's strategic ...

SK Hynix announces $13B South Korea plant for HBM chip packaging targeting AI data centers, with construction starting April ...

In a significant step towards building a domestic semiconductor ecosystem, the Ministry of Electronics and IT on Saturday ...

Shortages of a key chip packaging technology are constraining the supply of some processors, Taiwan Semiconductor Manufacturing Co. Ltd. chair Mark Liu has revealed. Liu made the remarks during a ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...