PORTLAND, Ore. — Tessera Technologies Inc. (San Jose, Calif.) announced today (Dec. 11) what it says is one of the slimmest surface-mountable wafer-level chip-scale packages (WLCSPs) available for ...

San Jose, Calif. — Toshiba America Electronic Components, Inc. (TAEC) has unveiled three Dynastron image sensors based on its high-sensitivity pixel technology and two new chip-scale camera modules ...

LED manufacturer Osram Opto Semiconductors says it has come up with a completely new module for mobile camera flash applications that combines two different white-light emitters under a common lens.

The Ricoh GXR was an innovative camera dating back to 2009. Back at the time the first mirrorless camera were coming onto the market, Ricoh took a radically different approach to making an ...