Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
The size and performance advantages of FinFETs are leading to a general industry adoption of these 3D transistors at the more advanced technology nodes. These complex transistors, however, exacerbate ...
Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...
A study published in Molecules and led by researchers from the Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP) of the Chinese Academy of Sciences demonstrated how deep learning can ...
“The eDR-7000 offers the opportunity to thoroughly understand the defect population on the wafer,” said Cecelia Campochiaro, Ph.D., vice president and general manager of KLA-Tencor's e-Beam Technology ...
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