Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

ANDOVER, Mass., March 18, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (MRCY) (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today ...

A new job posting from SpaceX mentions the company wants to develop compact 'multi-chip modules' to handle radio frequencies ...

ANDOVER, Mass., Jan. 22, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today introduced ...

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

The QPF5001 X-band FEM incorporates a power amplifier, low-noise amplifier (LNA), and limiter. Half the size of a discrete component implementation, the MCM targets the 8- to 12-GHz X-Band. The ...

NXP Semiconductors has announced a family of top-side cooled radio frequency (RF) amplifier modules, based on a packaging design intended to enable thinner and lighter radios for 5G infrastructure.

Qualcomm today announced the launch of a new RF front-end module that supports Bluetooth, Wi-Fi 6E and next-generation Wi-Fi 7. This module also works for automotive, XR extended reality, PC, wearable ...

In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...