Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
A new technical paper titled “MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia Tech. “Increasing AI computing ...
Dec. 02, 2020 9:35 AM ETNXP Semiconductors N.V. (NXPI) Stock NXPIBy: SA News Team ...
Addressing the need for higher frequency and current in dc/dc converters, the TB7001FL multi-chip module combines a high side MOSFET, a MOSBD to handle low-side functions, and a driver IC that ...
ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, announced today that it is working toward the first all-digital, ultra-low-latency chip-to-chip link between quantum ...
Rivian announced a series of hardware and software developments intended to support its long-term autonomy and artificial intelligence strategy during its first Autonomy & AI Day event, held at its ...
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