We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new ...

Pattern formation in physical, biological, and sociological systems has been studied for many years. One area where it has been of growing interest is in crime modeling. Pattern formation in physical, ...

Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...

This 12-part blog series is designed to answer this question by providing guidance on data modeling patterns for 12 common use cases. To help you get to a blog that can help you build now, the ...