I wore the world's first HDR10 smart glasses TCL's new E Ink tablet beats the Remarkable and Kindle Anker's new charger is one of the most unique I've ever seen Best laptop cooling pads Best flip ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon components onto each other for quite some time. Now, Samsung is apparently ready to debut a significant ...

Kioxia Corporation today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) (1) enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the ...

Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...

AMD is hosting its Fusion Developer Summit this week, and the overarching theme is heterogeneous computing and the convergence of the CPU and GPU. Is shared memory and true heterogeneous computing the ...