Intel has released a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. The new package, called the ...
Today’s sophisticated vehicles leverage embedded systems for everything from infotainment to powertrain management. Even low-end automobiles incorporate scores of electronic control units (ECUs). By ...
TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...
Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
NEC Electronics with Elpida Memory and Oki Electric, has developed technology to allow cell phones and portable devices to have as much memory as a high-performance computer. Single Package Can House ...
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