Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

The effectiveness of semiconductor manufacturing test directly impacts the quality and reliability of shipped silicon and the economical efficiency of overall test costs within the supply chain.

Once IC fabrication is complete, engineers use fault models to create test patterns that detect defects. These fault models are typically abstractions of defect behavior based on our experience and ...