Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...
Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
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AI-based model measures atomic defects in materials
In biology, defects are generally bad. But in materials science, defects can be intentionally tuned to give materials useful ...
A new model measures defects that can be leveraged to improve materials' mechanical strength, heat transfer, and ...
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