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  1. LayTec - Integrated metrology for advanced processes

    LayTec: integrated in-situ metrology for thin-film and semiconductor manufacturing. Improve yield, process control, device performance for epitaxy, etch and PV.

  2. In-situ Wafer Temperature and Reflectance Metrology - LayTec

    EpiTT measures wafer temperature, multi-wavelength reflectance in real time for information on growth rate, film thickness of thin films during epitaxial growth

  3. LayTec: Integrated metrology for advanced processes

    Company LayTec develops and manufactures metrology-based solutions that enable high yield and high performance manufacturing, advanced process control and related R&D. LayTec’s integrated …

  4. LayTec: thin film and semiconductor process monitoring and control …

    LayTec’s product portfolio covers all areas of thin film and semiconductor process monitoring and control and offers all required solutions from one source.

  5. EpiX® – 2D Optical Wafer Mapping & Metrology Station | LayTec

    EpiX ® mapping stations provide fast, non-contact 2D measurement of critical optical wafer properties. By combining white light reflectance, photoluminescence and wafer bow mapping in one platform, …

  6. AbsoluT – Absolute Wafer Temperature Calibration | LayTec

    AbsoluT AbsoluT provides a precise simulated temperature for on-site temperature calibration of LayTec's EpiTT and EpiCurve ® TT.

  7. Another EpiX® C2C mapping station has just been picked up at LayTec …

    Jul 10, 2024 · Many thanks to our colleagues for ensuring that the tool arrives safely at our customer! The EpiX ® C2C tool is a cassette-to-cassette white light reflectance and photoluminescence …

  8. EpiCurve® TT – In-situ Wafer Curvature, Reflectance, and ... - LayTec

    EpiCurve® TT for Combining wafer curvature measurements with emissivity-corrected pyrometry, growth rate/thickness measurements by three-wavelength reflectance.

  9. Metrology for MOCVD Processes - Latest Progress Thomas Zettler1, Frank Brunner2, Arne Knauer2, Andre Maaßdorf2, Markus Weyers2, Benjamin Buick1, Claudine Groß1, Christian Kaspari1, Thomas …

  10. MOCVD of InGaAsP/InP and InGaAlAs/InP based device structures: full replacement of ex-situ process calibration by advanced in-situ metrology A.J. SpringThorpe, O.J. Pitts, O. Salehzadeh Einabad,